MIT researchers have developed a new fabrication method that could enable the production of more energy efficient electronics by stacking multiple functional components on top of one existing circuit.

Researchers have made a major advance in quantum computing with a new device that is nearly 100 times smaller than the ...

The emergence of artificial intelligence is prompting changes in several industries, including journalism, as they ...

A chip smaller than a human hair may be the missing link to truly ...

Paper detailing this breakthrough to be published by the Institute of Electrical and Electronics Engineers (IEEE) as part of a project under the National ...

Access to power is changing the industry's view about energy efficiency, which impacts all levels of the system stack and ...

BISC is an ultra-thin, single-chip brain-computer interface that sits between the brain and skull and uses 65,536 electrodes. The implant streams high-bandwidth neural data over a custom UWB link to a ...

What many engineers once saw as a flaw in organic electronics could actually make these devices more stable and reliable, ...

Over the past decades, engineers have introduced numerous technologies that rely on light and its underlying characteristics.

Taking advantage of quantum mechanical effects can be an alternative method for modifying current in high-sensitivity ...