MIT researchers have developed a new fabrication method that could enable the production of more energy efficient electronics by stacking multiple functional components on top of one existing circuit.

Much EV development prompts digital innovation, yet tried-and-true analog approaches, such as LLCs offer measurable benefits.

Conventional petroleum-based adhesives rely heavily on the petrochemical industry and pose environmental risks due to harmful ...

Quilter's AI designed a working 843-component Linux computer in 38 hours—a task that typically takes engineers 11 weeks. Here ...

PEACHTREE CITY, GA – December 9, 2025 – The exhibition floor space for PCB East 2026 is more than 70% booked and is expected to sell out, the Printed Circuit Engineering Association ( PCEA) said today ...

Local businesses and citizens, including Mouser employees, were encouraged to bring new, unwrapped toys to contribute to the toy drive, with the collected toys earmarked for needy families in the ...

Vacuum conditions, radiation, and electrical interference can compromise performance, requiring material and design ...

Integrated circuits are the brains behind modern electronic devices like computers or smart phones. Traditionally, these ...

A new brain implant stands to transform human-computer interaction and expand treatment possibilities for neurological ...

A radically miniaturized brain implant called BISC is redefining what’s possible in human–computer interaction, offering a ...

Iron-on circuit; thermal drawing of e-fibers; recyclable, self-healing circuits; 'living metal' bioelectronics.

Researchers have combined liquid metal and a heat-activated adhesive to create an electrically conductive patch that bonds to ...