Power Integrations recommends the use of IR/convection reflow for surface-mount attach of the InSOP package. However, the InSOP package was designed with wave soldering in-mind in case IR/ convection ...
A new family of larger connectors is compatible with through-hole PCB mounting for strength and reflow soldering in ...
Common inverter construction today features large Through-The-Hole (TTH) components along with smaller SMD devices on one side of the PCB, with the power module mounted on the other side and connected ...
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