Micro-electro-mechanical systems have been available for years, and have been successful in selected high-volume applications. But MEMS design is not as organized as it could be. MEMS design typically ...

SpringSoft Completes OpenAccess-Compatible IC Layout Flow with Enhancements to Laker ADP Design Entry System The Laker™ Advanced Design Platform integrates the full-featured Laker schematic editor, ...

Santa Cruz, Calif. — At first glance, the Pilot Design Environment from Synopsys Inc. may sound like a resurrected EDA framework from the late 1980s. But Synopsys claims to be taking a fresh approach ...

Automotive applications, particularly those related to AI and computer vision, are a significant driver of the current semiconductor boom. Established companies are mostly thriving, it’s true, but ...

SAN JOSE, Calif.--(BUSINESS WIRE)--Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced that its custom and analog/mixed-signal (AMS) IC design flow has achieved certification for Samsung ...

The FICS Research Institute (University of Florida) has published a new research paper titled “Secure Physical Design.” This is the first and most comprehensive research work done in this area that ...

Cadence Design Systems and United Microelectronics Corporation (UMC) have jointly announced that the US-based EDA firm's analog/mixed-signal (AMS) IC design flow has achieved certification for the ...

Ansys® Redhawk-SC™ and Ansys® Redhawk-SC Electrothermal™ multiphysics power integrity and 3D-IC thermal integrity platforms are certified as compliant with TSMC's 3Dblox standard for 3D-IC design ...

Cadence Design Systems' analog and mixed-signal (AMS) IC design flow has been certified for United Microelectronics' (UMC) 22ULP/ULL process technologies, according to the companies. This flow ...

Integrity 3D-IC is Cadence’s next-generation multi-chip design solution, integrating silicon and package planning and implementation with system analysis and signoff to enable system-driven PPA ...