That’s where IC packaging comes in. It’s like the housing for your phone or the case for your computer – it does a lot more than just look pretty. We’re going to break down what IC packaging is all ...

Packaging houses are readying their next-generation advanced IC packages, paving the way toward new and innovative system-level chip designs. It’s a confusing landscape with a plethora of buzzwords ...

Chipmakers, OSATs and R&D organizations are developing the next wave of fan-out packages for a range of applications, but sorting out the new options and finding the right solution is proving to be a ...

Intel disclosed several chip packaging breakthroughs at the Electronic Components Technology Conference (ECTC), outlining the technical merits of multiple new chip packaging techniques. We spoke with ...

So, you’ve probably heard the term “flip chip IC” floating around, especially if you’re into electronics. It’s ...

SANTA CLARA, Calif. — Competition is mounting for small chip-packages that support higher-performance ICs with fewer than 100 contacts in space-constrained systems–such as cell phones, PDAs, laptop ...

TSMC first developed its CoWoS package for advanced chips in 2012 and combined with HBM in 2016. The explosion of generative AI technology such as ChatGPT has been a catalyst for growth of TSMC’s ...

Check out Electronic Design's coverage of DesignCon 2024. The semiconductor industry is entering the age of the chiplet. Today, many of the world’s most advanced chips consist of several smaller ...

The United States Patent for Intel's multi-chip package and die-to-die interconnect has been published in full. Initially filed in January, 2018, the patent outlines a few weird and wonderful ways of ...

SEOUL, Korea — South Korea's Samsung Electronics Co. Ltd. here announced what the company calls the world's smallest IC package for flash memory devices. Samsung rolled out a 512-Mbit, NAND-based ...