Ansys® Redhawk-SC™ and Ansys® Redhawk-SC Electrothermal™ multiphysics power integrity and 3D-IC thermal integrity platforms are certified as compliant with TSMC's 3Dblox standard for 3D-IC design ...
" Ansys' continued collaboration with Synopsys and TSMC drives innovation in 3D-IC design and improves chip reliability for the most demanding applications," said John Lee, vice president and general ...
Through continued collaboration with TSMC, Ansys announced enhanced AI-assisted workflows for radio frequency (RF) design migration and photonic integrated circuits (PICs), and new certifications for ...
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